- Module location : SLC 5/02 or later chassis
- Module defaults : Node Address ?C 63, Baud Rate ?C 125 Kbps
- Power consumption : Backplane current = 5V DC, 500 mA ; DeviceNet = 24V DC, 90 mA Class 2.
- Isolation voltage : 30V (continuous), Basic Insulation Type. Tested at 500V AC for 60 s, DeviceNet to backplane
- Temperature, operating : IEC 60068-2-1 (Test Ad, Operating Cold), IEC 60068-2-2 (Test Bd, Operating Dry Heat), IEC 60068-2-14 (Test Nb, Operating Thermal Shock) : 0??60 o C (32??140 o F).
- Relative humidity : IEC 60068-2-30 (Test Db, Unpackaged Damp Heat): 5??95% non-condensing
- Vibration : IEC60068-2-6 (Test Fc, Operating): 2 g @10??500 Hz
- Shock : IEC60068-2-27:1987, Test Ea (Unpackaged shock, ES#002). Operating = 30 g, Non-operating = 50 g
- Emissions : CISPR 11: Group 1, Class A (with appropriate enclosure)
- ESD immunity : IEC 61000-4-2 : 6 kV contact discharges, 8 kV air discharges
- Radiated RF immunity : IEC 61000-4-3 : 10 V/m with 1 kHz sine-wave 80% AM from 80??2000 Mhz
- Enclosure type rating : None (open style)
- Dimensions(LxWxH):12.7 cm x 5.1 cm x 15.2 cm
- Weight??0.3kg
- Country of Origin: United States
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